Surface micromachined electrostatic diaphragm micropump

被引：0

作者：

Jang, WI ^{[1
]}

Lee, YI ^{[1
]}

Choi, CA ^{[1
]}

Jun, CH ^{[1
]}

Kim, YT ^{[1
]}

机构：

[1] Elect & Telecommun Res Inst, Basic Telecommun Res Lab, Taejon 305600, South Korea

来源：

ELECTRONICS AND STRUCTURES FOR MEMS | 1999年 / 3891卷

关键词：

surface micromachining; gas-phase etching; electrostatic; micropump;

D O I：

10.1117/12.364469

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An electrostatic diaphragm micropump for fluids and gases has been designed and fabricated by silicon surface micromachining. Diaphragm structures are bridge-type, cantilever-type and fan-type polysilicon, and sacrificial layers are low-temperature oxide (LTO) on polysilicon substrates. The developed anhydrous HF gas-phase etching of sacrificial oxide on polysilicon substrates has been employed to release polysilicon microstructures. The fabricated micropump with size of the order of 1mm(2) operates at square wave voltage of 10V and 2Hz under near room temperature and normal atmospheric pressure.

引用

页码：395 / 402

页数：8

共 12 条

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