Integrating band engineering with point defect scattering for high thermoelectric performance in Bi2Si2Te6

被引:30
作者
Chen, Chen [1 ]
Shen, Dongyi [1 ]
Xia, Chengliang [1 ]
Zhang, Zongwei [2 ]
Wang, Wenxuan [1 ]
Zhang, Qian [2 ,3 ]
Chen, Yue [1 ,4 ]
机构
[1] Univ Hong Kong, Dept Mech Engn, Pokfulam Rd, Hong Kong, Peoples R China
[2] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[3] Harbin Inst Technol, Sch Mat Sci & Engn, Shenzhen 518055, Peoples R China
[4] HKU, Zhejiang Inst Res & Innovat, 1623 Dayuan Rd, Hong Kong 311305, Peoples R China
基金
中国国家自然科学基金;
关键词
THERMAL-CONDUCTIVITY;
D O I
10.1016/j.cej.2022.135968
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
A layer-structure compound Bi2Si2Te6 is introduced as a promising thermoelectric material. The intrinsic low lattice thermal conductivity of Bi2Si2Te6 is because of the low phonon group velocities near the gamma point and the overlap of optical and acoustic phonon branches. A further decreased thermal conductivity is obtained by alloying Sb at the Bi site for the additional point-defect scattering of phonons. This Sb alloying also enhances the density-of-states near the valence band maximum for a larger carrier effective mass, and suppresses the bipolar effect by increasing the carrier concentration and widening the band gap. Benefitting from both the enhancement of power factor and the decrease of lattice thermal conductivity, the peak zT value is improved from similar to 0.45 at 573 K for Bi2Si2Te6 to -1.2 at 773 K for Bi2Si2Te6.
引用
收藏
页数:7
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