Total Ionizing Dose effects on a 28 nm Hi-K metal-gate CMOS technology up to 1 Grad

被引:25
作者
Mattiazzo, S. [1 ]
Bagatin, M. [1 ]
Bisello, D. [2 ,3 ]
Gerardin, S. [1 ,3 ]
Marchioro, A. [4 ]
Paccagnella, A. [1 ,3 ]
Pantano, D. [2 ,3 ]
Pezzotta, A. [5 ,6 ,7 ]
Zhang, C-M. [7 ]
Baschirotto, A. [5 ,6 ]
机构
[1] Univ Padua, Dipartimento Ingn Informaz, Via G Gradenigo 6, I-35131 Padua, Italy
[2] Univ Padua, Dipartimento Fis & Astron, Via F Marzolo 8, I-35131 Padua, Italy
[3] INFN Sez Padova, Via F Marzolo 8, I-35131 Padua, Italy
[4] CERN, CH-1211 Geneva 23, Switzerland
[5] Univ Milano Bicocca, Dipartimento Fis, Piazza Sci 3, I-20126 Milan, Italy
[6] INFN Sez Milano Bicocca, Piazza Sci 3, I-20126 Milan, Italy
[7] Ecole Polytech Fed Lausanne, ICLAB, Rue Maladiere 71, CH-2000 Neuchatel, Switzerland
基金
瑞士国家科学基金会;
关键词
Radiation-hard electronics; Front-end electronics for detector readout; TRANSISTORS;
D O I
10.1088/1748-0221/12/02/C02003
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
This paper presents the results of an irradiation study on single transistors manufactured in a 28 nm high-k commercial CMOS technology up to 1 Grad. Both nMOSFET and pMOSFET transistors have been irradiated and electrical parameters have been measured. For nMOSFETs, the leakage current shows an increase of 2-3 orders of magnitude, while only moderate degradation for other parameters has been observed. For pMOSFETs, a more severe degradation of parameters has been measured, especially in the drain current. This work is relevant as the evaluation of a new generation of CMOS technologies to be used in future HEP experiments.
引用
收藏
页数:9
相关论文
共 9 条
[1]  
Alexander D. R., 1996, IEEE NUCL SPAC RAD E
[2]   Radiation tolerant VLSI circuits in standard deep submicron CMOS technologies for the LHC experiments: Practical design aspects [J].
Anelli, G ;
Campbell, M ;
Delmastro, M ;
Faccio, F ;
Florian, S ;
Giraldo, A ;
Heijne, E ;
Jarron, P ;
Kloukinas, K ;
Marchioro, A ;
Moreira, P ;
Snoeys, W .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1999, 46 (06) :1690-1696
[3]  
Bisello D., 2014, RADIAT PHYS CHEM, V71, P713
[4]  
Enlow E., 1987, TECHNICAL REPORT
[5]   Radiation-induced edge effects in deep submicron CMOS transistors [J].
Faccio, F ;
Cervelli, G .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2005, 52 (06) :2413-2420
[6]   Radiation-Induced Short Channel (RISCE) and Narrow Channel (RINCE) Effects in 65 and 130 nm MOSFETs [J].
Faccio, F. ;
Michelis, S. ;
Cornale, D. ;
Paccagnella, A. ;
Gerardin, S. .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2015, 62 (06) :2933-2940
[7]   A RELIABLE APPROACH TO CHARGE-PUMPING MEASUREMENTS IN MOS-TRANSISTORS [J].
GROESENEKEN, G ;
MAES, HE ;
BELTRAN, N ;
DEKEERSMAECKER, RF .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1984, 31 (01) :42-53
[8]  
Mavis D.G., 1997, DIGITAL AVIONICS SYS, P26
[9]   Comparison of MOSFET-threshold-voltage extraction methods [J].
Terada, K ;
Nishiyama, K ;
Hatanaka, K .
SOLID-STATE ELECTRONICS, 2001, 45 (01) :35-40