Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging

被引：1

作者：

Huang, Lin ^{[1
]}

Lin, Xuenian ^{[1
]}

Chen, Renwu ^{[1
]}

Wang, Jiangyong ^{[1
]}

机构：

[1] Shantou Univ, Dept Phys, Shantou 515063, Guangdong, Peoples R China

来源：

CURRENT TRENDS IN THE DEVELOPMENT OF INDUSTRY, PTS 1 AND 2 | 2013年 / 785-786卷

关键词：

Sn whisker; growth mechanism; Cu-Sn bilayer film; intermetallic compound;

D O I：

10.4028/www.scientific.net/AMR.785-786.918

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging was investigated by scanning electron microscope and X-ray diffraction techniques. The experimental observations indicate that the Sn whisker growth on the Cu surface in Cu-Sn bilayer system is different from that on the Sn surface in Sn-Cu bilayer system. When the Sn sublayer thickness is less than 0.5 mu m, the Sn whisker growth can take place in Cu-Sn system but not in Sn-Cu system. An explanation for Sn whisker growth in Cu-Sn bilayer system is given.

引用

页码：918 / 923

页数：6

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