The Effect of Clean and No-clean Flux in Enhancing the Wettability of Eutectic Solder Bump Flip Chip PBGA

被引：0

作者：

Amin, Nowshad ^{[1
]}

Cheah, Ang Ye ^{[1
]}

Kornain, Zainudin ^{[1
]}

Ahmad, Ibrahim ^{[2
]}

机构：

[1] Univ Kebangsaan Malaysia, Fac Engn, Dept Elect Elect & Syst Engn, Bangi 43600, Selangor, Malaysia

[2] Univ Tenaga Nas, Coll Engn, Dept Elect & Commun, Selangor, 43009, Malaysia

来源：

ICSE: 2008 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS, PROCEEDINGS | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Five different types of clean flux and no-clean flux, which are mainly used in nip chip die attach, have been analyzed in respect to the wettability of cutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed with different types of flux. Various types of clean and no-clean flux are measured and placed on top of silicon die. The effect of the flux has been observed by measuring the spreading area of the eutectic solder bump processed with different types of clean and no-clean fluxes by using Leica Quin Colour (RGB) after the heat treatment. Comparative studies on clean and no-clean fluxes are therefore obtained. Clean flux has shown better wettability on the high lead solder pad proving it to be the optimum choice as also supported by the die pull results. Moreover, the fluxes are tested under thermal gravimetric analyzer (TGA) to observe the flux weight loss on the melting point of eutectic solder bump to correlate with the earlier results.

引用

页码：388 / +

页数：2