Fabrication and characterization of Co/Cu/Co/NiO/Si(100) magnetic multilayer

In this investigation, we have fabricated Co/Cu/Co/NiO/Si(100) magnetic multilayer structure using a combinative sputtering-evaporation technique. Nickel Oxide with a thickness of about 30 nm was deposited on Si(100) substrate by thermal evaporation method. Following the oxide deposition, cobalt and copper films with a thickness of about 3 and 2 nm were grown by employing DC conventional and DC magnetron sputtering methods without breaking the vacuum, respectively. To understand the role of interfaces in this structure, we have studied surface of the Co/NiO, Cu/Co/NiO and Co/Cu/Co/NiO systems by atomic force microscopy (AFM) and sheet resistance (R.) measurements. According to our data analysis the surface roughness of the top Co, Cu spacer and bottom Co were measured as 137, 0.56 and 1.52 nm, respectively. Based on potential dynamic corrosion measurements, the rate of corrosion for the top Co layer in H2O electrolyte was 0.22 mpy.