Thiirane functional spherosilicate as epoxy resin modifier

被引：11

作者：

Dutkiewicz, M. ^{[1
,2
]}

Szolyga, M. ^{[3
]}

Maciejewski, H. ^{[2
,3
]}

Marciniec, B. ^{[1
,3
]}

机构：

[1] Adam Mickiewicz Univ, Adv Technol Ctr, PL-60780 Poznan, Poland

[2] Adam Mickiewicz Univ Fdn, PL-61612 Poznan, Poland

[3] Adam Mickiewicz Univ, Fac Chem, PL-61614 Poznan, Poland

来源：

JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY | 2014年 / 117卷 / 01期

关键词：

Thiirane; Silsesquioxane; Epoxide resin; Anhydride; POLYHEDRAL OLIGOMERIC SILSESQUIOXANE; NANOCOMPOSITES; OXIRANES; ANHYDRIDE; CATALYSTS; EFFICIENT; POSS;

D O I：

10.1007/s10973-014-3725-3

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Epoxy resin-based composites, also those containing POSS compounds, have been the subject of extensive research because of their attractive properties and broad practical applications. However, in some applications they suffer from too long curing times or not strong enough adhesion to metals. A solution to this problem is the use of episulfide (thiirane) derivatives or their combination with epoxies. In this paper, the synthesis of new octakis[(3-(thiiran-2-yloxy)propyl)dimethylsiloxy]octasilesquioxane from its 3-glycidoxypropyldimethylsiloxy analog is described. Results of study of its influence on thermal properties as well as curing processes of modified with this compound epoxy resins hardened with maleic, phthalic, and pyromellitic anhydrides are also presented. It is shown that addition of this new thiirane functional POSS compound can significantly increase thermal stability of obtained epoxy resin composites and decrease its curing temperatures.

引用

页码：259 / 264

页数：6

共 34 条

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