Electrodeposition of Sn-Ag-Cu alloys

被引：11
|
作者：
Arai, S [1 ]
Kaneko, N [1 ]
机构：
[1] SHINSHU UNIV,FAC ENGN,NAGANO 380,JAPAN
来源：
DENKI KAGAKU | 1997年 / 65卷 / 12期
关键词：
Pb-free solder; Sn-Ag-Cu Alloy; electrodeposition; non-cyanide bath;
D O I：
10.5796/kogyobutsurikagaku.65.1102
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Sn-Ag-Cu alloys could be electrodeposited from a non-cyanide bath containing potassium pyrophosphate and potassium iodide as the complexing agents for Sn, Ag and Cu. Alloys containing Ag in the range of 1.7 to 8.7 atomic percent and Cu in the range of 2.0 to 11.1 atomic percent were formed at room temperature (25 +/- 2 degrees C) without agitation under the galvanostatic conditions (current densities:2 to 20mAcm(-2)). The Ag and Cu contents in the electrodeposits decreased with increasing current density. The morphology was influenced by the deposits composition. The solidus temperature of the electrodeposits obtained in this study was about 217 degrees C.
引用
收藏
页码：1102 / 1106
页数：5
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