Local microscopic observation of passive integrated circuits by focused ion beam system

被引:1
|
作者
Nishi, Y [1 ]
Matsushita, Y [1 ]
Iwazaki, Y [1 ]
Fujimoto, M [1 ]
机构
[1] Taiyo Yuden Co Ltd, Wireless Informat Network Grp, Adv Mat & Devices Lab, Haruna, Gunma 3703347, Japan
关键词
thin film capacitor; integration; microstructure; FIB; TEM;
D O I
10.2109/jcersj.110.440
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Focused ion beam (FIB) system was applied to sample preparation for local microscopic observation of passive thin-film elements integrated into a semiconductor substrate. The newly developed microsampling method is suitable not only for scanning electron microscopy (SEM) observation but also for transmission electron microscopy (TEM) observation. By adopting this method, microstructures and their ramifications in SrTiO3 MIM (metal-insulator-metal) thin-film capacitors fabricated on integrated circuits were clearly revealed.
引用
收藏
页码:440 / 443
页数:4
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