Effect of Temperature and Strain Rate on Dynamic Mechanical Properties of Low Silver Lead-Free Solder

被引：0

作者：

Niu Xiaoyan ^{[1
]}

Li Na ^{[1
]}

Shu Xuefeng ^{[2
]}

机构：

[1] Hebei Univ, Baoding 071002, Peoples R China

[2] Taiyuan Univ Technol, Taiyuan 030024, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2014年 / 43卷 / 09期

关键词：

low silver lead-free solder; SHPB; temperature effect; strain rate effect; Johnson-Cook model; DROP-IMPACT; JOINTS;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The mechanical properties of low silver lead-free solder Sn0.3Ag0.7Cu were characterized by an electronic universal material testing system and Split Hopkinson Pressure Bar (SHPB) under different working conditions. The influence of strain rate and temperature on the dynamic performance was analyzed. The results show that the stress-strain curves of low silver solder Sn0.3Ag0.7Cu are influenced by temperature softening and strain rate hardening effects. In different temperature ranges, strain rate hardening and temperature softening effects on the plastic deformation of low silver solder Sn0.3Ag0.7Cu are different. The dynamic constitutive relationship was determined through these experiments based on Johnson-Cook model. In the plastic flat phase of Sn0.3Ag0.7Cu, the dynamic constitutive relationship and experimental data have a good agreement.

引用

页码：2167 / 2171

页数：5

共 12 条

[1]

Bi WZ, 2012, RARE METAL MAT ENG, V41, P744

[2] Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys [J].