Mechanical, electrical, and piezoresistivity behaviors of additively manufactured acrylonitrile butadiene styrene/carbon nanotube nanocomposites

被引:30
作者
Thaler, Dominic [1 ]
Aliheidari, Nahal [1 ]
Ameli, Amir [1 ]
机构
[1] Washington State Univ, Sch Mech & Mat Engn, Adv Composites Lab, 2710 Crimson Way, Richland, WA 99354 USA
关键词
fused filament fabrication; 3D printing; nanocomposite; carbon nanotube; fracture resistance; electrical conductivity; piezoresistivity; INTERFERENCE SHIELDING EFFECTIVENESS; STRAIN SENSORS; FRACTURE-RESISTANCE; CARBON NANOTUBES; COMPOSITES; MICROSTRUCTURE;
D O I
10.1088/1361-665X/ab256e
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Tensile, fracture, electrical, and piezoresistivity behaviors of additively manufactured acrylonitrile butadiene styrene (ABS)/carbon nanotube (CNT) nanocomposites were investigated. Filaments with CNT contents up to 10 wt% were fabricated using a twin-screw extruder and 3D printed through fused filament fabrication (FFF). The printed ABS samples showed similar or better strength, stiffness, and strain-at-break values, compared to those of compression-molded counterparts. The strength and stiffness of the printed ABS were significantly enhanced by introducing CNT, with an optimum content of similar to 3.0-5.0 wt%. The ductile fracture behavior and high fracture resistance (K-Ic = 2.2-2.4 MPa m(1/2) and G(Q) = 3 kJ m(-2)) of ABS was maintained in the nanocomposites with a maximum CNT content of 3.0 wt%, beyond which it decreased significantly. The printed samples' conductivity was at least one order of magnitude lower than that of the compression-molded ones. Moreover, the inlayer conductivity was about two orders of magnitudes higher than the through-layer one, introducing a noticeable anisotropy at lower CNT contents. The piezoresistivity tests revealed a relatively linear resistance-strain relationship for the elastic region. A sudden change in the resistance was also detected at the onset of plastic deformation. These variations in the mechanical and electrical behaviors were explained in terms of the CNT agglomerates, CNT alignment, interlayer bond quality, and the inter-raster voids.
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页数:12
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