Ultra-thin and high-density packaging using both sides flip chip technology

被引：0

作者：

Nishida, K ^{[1
]}

Shimizu, K ^{[1
]}

Yoshino, N ^{[1
]}

Koguchi, H ^{[1
]}

Taweejun, N ^{[1
]}

机构：

[1] Matsushita Elect Ind Co Ltd, Kadoma, Osaka 5718502, Japan

来源：

ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 2 | 2003年

关键词：

D O I：

暂无

中图分类号：

V [航空、航天];

学科分类号：

08 ; 0825 ;

摘要：

We have developed a high-density packaging technology by using a thin IC and a thin substrate and bonding it by new flip chip technology. Numerical analysis with the finite element method (FEM) as well experiments clearly showed that deflection of the IC and reliability were affected by the IC thickness. Consequently, reliability could be improved by reducing IC thickness. The dependency of the life in single-sided CSP and both-sided CSP on the thickness of IC and substrate could be expressed using a normal stress in the thickness direction and shear stress in the vertical cross section, respectively. Moreover, a both-sided flip chip approach solved the problem of warpage. A high-capacity memory card of 512 MB was put to practical use by applying these results. This increased the Si density by four times over that of a conventional chip-size package (CSP).

引用

页码：819 / 826

页数：8