Shape memory behavior of Ti-Ni-Cu thin films

被引：39

作者：

Ishida, A. ^{[1
]}

Sato, M. ^{[1
]}

Ogawa, K. ^{[1
]}

Yamada, K. ^{[1
]}

机构：

[1] Natl Inst Mat Sci, Tsukuba, Ibaraki 3050047, Japan

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2006年 / 438卷

关键词：

shape memory; sputtering; MEMS; thin film; Ti-Ni-Cu; TRANSFORMATIONS; DEPOSITION; TI-X(NI; CU)(1-X);

D O I：

10.1016/j.msea.2006.02.154

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Three kinds of Ti-rich Ti-Ni-Cu thin films (Ti51.9Ni41.Cu-6(6.5), Ti51.6Ni36.8Cu11.6, Ti51.5Ni33.1Cu15.4) and three kinds of (Ni, Cu)-rich Ti-Ni-Cu thin films (Ti48.9Ni44.9Cu6.2, Ti48.5Ni40.0Cu11.5, Ti48.6Ni35.9Cu15.5), numbers indicate at.%, were prepared by sputtering and annealed at 773, 873 and 973 K for 1 h. X-ray diffraction patterns showed that the Ti-rich thin films contain Ti2Ni and Ti2Cu phases, while the (Ni, Cu)-rich thin films contain a TiNiCu phase. The B2 -> B19' martensitic transformation occurred below 10 at.% Cu, while the B2 -> B19 martensitic transformation occurred above 10at.% Cu. The transformation temperature increased with increasing Cu content and annealing temperature. The temperature hystereses were small compared with those of Ti-Ni binary alloy thin films. The maximum recoverable strain decreases with increasing annealing temperature. It also decreases with increasing Cu content when the Cu content is more than 10 at.%. The critical stress for inducing plastic deformation increases with decreasing annealing temperature and increasing Cu content. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：683 / 686

页数：4

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