Hardness, electrical resistivity, and modeling of in situ Cu-Nb microcomposites

被引：50

作者：

Deng, Liping ^{[1
,2
]}

Han, Ke ^{[2
]}

Hartwig, Karl T. ^{[3
]}

Siegrist, Theo M. ^{[2
]}

Dong, Lianyang ^{[2
]}

Sun, Zeyuan ^{[1
]}

Yang, Xiaofang ^{[1
]}

Liu, Qing ^{[1
]}

机构：

[1] Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China

[2] Natl High Magnet Field Lab, Tallahassee, FL 32310 USA

[3] Texas A&M Univ, College Stn, TX 77843 USA

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2014年 / 602卷

基金：

新加坡国家研究基金会; 中国国家自然科学基金;

关键词：

In situ Cu-Nb microcomposite; Hall-Petch; Interface area density; Solid solution hardening; MECHANICAL-PROPERTIES; HIGH-STRENGTH; LAYERED COMPOSITES; MICROSTRUCTURE; DEFORMATION; CONDUCTIVITY; AG; SIMULATION; CONDUCTORS; BEHAVIOR;

D O I：

10.1016/j.jallcom.2014.03.021

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

This paper reports our investigation on the evolution of microstructure, hardness, and electrical conductivity of in situ Cu-16.5 vol.% Nb microcomposites as a function of drawing strain. Both interface area density and lattice distortion were taken into account for analyzing the hardness and resistivity at different levels of plastic strain. A model was developed for describing microstructure dimensions including both spacing and curl of Nb ribbons. Based on this model, a modified Hall-Petch formula was derived. Our results suggest that interface area density and lattice distortion have significant impacts on both hardness and electrical resistivity. (C) 2014 Elsevier B. V. All rights reserved.

引用

页码：331 / 338

页数：8

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