An accurate and efficient analysis method for multi-Gb/s chip-to-chip signaling schemes

被引:175
作者
Casper, BK [1 ]
Haycock, M [1 ]
Mooney, R [1 ]
机构
[1] Intel Labs, Circuit Res, Hillsboro, OR USA
来源
2002 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS | 2002年
关键词
D O I
10.1109/VLSIC.2002.1015043
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper introduces an accurate method of modeling the performance of high-speed chip-to-chip signaling systems. Implemented in a simulation tool, it precisely accounts for intersymbol interference, cross-talk and echos as well as circuit related effects such as thermal noise, power supply noise and receiver jitter. We correlated the simulation tool to actual measurements of a high-speed signaling system and then used this tool to make tradeoffs between different methods of chip-to-chip signaling with and without equalization.
引用
收藏
页码:54 / 57
页数:4
相关论文
共 7 条
[1]  
HAYCOCK M, 1997, HOT INT 5 S REC AUG, P149
[2]  
HAYCOCK M, 2001, ISSCC 2001 DIGEST TE
[3]   CALCULATING ERROR PROBABILITIES FOR INTERSYMBOL AND COCHANNEL INTERFERENCE [J].
HELSTROM, CW .
IEEE TRANSACTIONS ON COMMUNICATIONS, 1986, 34 (05) :430-435
[4]   A 900 Mb/s bidirectional signaling scheme [J].
Mooney, R ;
Dike, C ;
Borkar, S .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1995, 30 (12) :1538-1543
[5]  
NAIR R, 2001, ISSCC 2001 DIG TECHN
[6]  
Proakis J. G., 1995, DIGITAL COMMUNICATIO, P602
[7]   A six-port 30-GB/s nonblocking router component using point-to-point simultaneous bidirectional signaling for high-bandwidth interconnects [J].
Wilson, H ;
Haycock, M .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2001, 36 (12) :1954-1963