Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying

被引：18

作者：

Xian, J. W. ^{[1
]}

Belyakov, S. A. ^{[1
]}

Gourlay, C. M. ^{[1
]}

机构：

[1] Univ London Imperial Coll Sci Technol & Med, Dept Mat, London SW7 2AZ, England

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2016年 / 45卷 / 01期

基金：

英国工程与自然科学研究理事会;

关键词：

Pb-free soldering; grain refinement; intermetallics; crystal growth; orientation relationship (OR); heterogeneous nucleation; SN-CU; SOLDER ALLOYS; PHASE; ETA-CU6SN5; ADDITIONS; GROWTH;

D O I：

10.1007/s11664-015-4092-y

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We show that dilute Al additions can control the size of primary Cu6Sn5 rods in Sn-0.7Cu/Cu ball grid array joints. In Sn-0.7Cu-0.05Al/Cu joints, the number of primary Cu6Sn5 per mm(2) is 7 times higher and the mean three-dimensional length of rods is 4 times smaller than in Al-free Sn-0.7Cu/Cu joints, while the area fraction of primary Cu6Sn5 is similar. It is shown that epitaxial nucleation of primary Cu6Sn5 occurs on delta-Cu33Al17 or gamma (1)-Cu9Al4 particles, which are stablea in pound the Sn-0.7Cu-0.05Al melt during holding at 250A degrees C. The observed facet relationships agree well with previously determined orientation relationships between delta-Cu33Al17 and Cu6Sn5 in hypereutectic Sn-Cu-Al alloys and result in a good lattice match with < 2.5% lattice mismatch on two different interfacial planes.

引用

页码：69 / 78

页数：10

共 19 条

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