Elastic thermal stresses in a hollow circular overlay/substrate system

被引：9

作者：

Liu, Y. J. ^{[1
]}

Yin, H. M. ^{[1
]}

机构：

[1] Columbia Univ, Dept Civil Engn & Engn Mech, New York, NY 10027 USA

来源：

MECHANICS RESEARCH COMMUNICATIONS | 2014年 / 55卷

基金：

美国国家科学基金会;

关键词：

Thermal stress; Hollow circular overlay; Layered materials; Spiral cracking; Elastic analysis; CRACK PATTERNS; MODE CRACKING; THIN; CONTACT; DAMAGE; FILM;

D O I：

10.1016/j.mechrescom.2013.10.002

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

This paper investigates the thermal elastic fields in the hollow circular overlay fully bonded to a rigid substrate, which is subjected to a temperature change. Following our previous work for a solid circular overlay/substrate system (Yuan and Yin, Mech. Res. Commun. 38, 283-287,2011), this paper presents a closed form approximate solution to the axisymmetric boundary value problem using the plane assumption, whose accuracy is verified by the finite element models. When the inner radius is reduced to zero, the present solution recovers the previous solution. When the outer radius approaches infinite, the solution provides the elastic fields for a tiny hole in the overlay. The effects of thickness and width of the overlay are investigated and discussed. When a circular crack initiates in a solid circular overlay, the fracture energy release rate is investigated. This solution is useful for thermal stress analysis of hollow circular thin film/substrate systems and for fracture analysis of spiral cracking in the similar structures. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：10 / 17

页数：8

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