Experimental Study on the Use of PCM-based Heat Sink for Cooling of Mobile Devices

被引：6
作者：
Wong, H. E.
Tan, F. L.
Fok, S. C.
机构：
来源：
EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3 | 2008年
关键词：
D O I：
10.1109/EPTC.2008.4763521
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Ail experimental study is conducted oil the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with n-eicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45 degrees to the horizontal) arc measured. In addition, the Surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks call be used to effectively manage the temperature of portable electronic devices. Based oil this finding, mathematical models arc currently being developed to facilitate the optimal designs of PCM-based heat sinks.
引用
收藏
页码：743 / 748
页数：6
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