The relationships between sputter deposition conditions, grain size, and phase transformation temperatures in NiTi thin films

被引：48
|
作者：
Kabla, M. [1 ,2 ]
Seiner, H. [3 ]
Musilova, M. [4 ]
Landa, M. [3 ]
Shilo, D. [1 ]
机构：
[1] Technion Israel Inst Technol, Fac Mech Engn, IL-32000 Haifa, Israel
[2] Rafael Adv Def Syst Ltd, Rafael, Israel
[3] Acad Sci Czech Republ, Inst Thermomech, Prague 18200, Czech Republic
[4] Czech Tech Univ, Fac Nucl Sci & Phys Engn, Prague 12000, Czech Republic
来源：
ACTA MATERIALIA | 2014年 / 70卷
关键词：
NiTi; SMA; Microstructure; Phase transformation; Sputtering; SHAPE-MEMORY ALLOYS; CRYSTALLIZATION KINETICS; ULTRASOUND SPECTROSCOPY; RESOLUTION;
D O I：
10.1016/j.actamat.2014.02.009
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Sputter-deposited NiTi films on full 100 mm wafers exhibit different phases, depending on the wafer region. Comprehensive characterization and analysis show that, unlike the common assumption, this effect is not related to the Ti/Ni stoichiometry. Instead, we show that the different phases are related to differences in grain size. Our results indicate the existence of a critical grain size of approximately 50-100 nm, below which a significant inhibition of the martensitic transformation occurs. Further, we study the effect of deposition conditions and show that a desired uniform martensitic film can be achieved by decreasing the impact energy of the deposited atoms. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：79 / 91
页数：13
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