Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

被引：119
作者：
Flanders, DR
Jacobs, EG
Pinizzotto, RF
机构：
[1] Materials Science Department, University of North Texas, Denton, TX 76203-0308
来源：
JOURNAL OF ELECTRONIC MATERIALS | 1997年 / 26卷 / 07期
关键词：
activation energy; Cu6Sn5; Cu3Sn; diffusion kinetics; intermetallic growth; Pb-free solder;
D O I：
10.1007/s11664-997-0268-4
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Intermetallic phases formed along a Sn-Ag eutectic solder/Cu interface during solid-state aging have been characterized and the activation energies of Cu,Sn and Cu,Sn, growth have been calculated. Diffusion couples consisting of Cu/ 96.5Sn-3.5Ag/Cu were aged at 110 to 208 degrees C, for 0 to 32 days. After aging, the Cu/ solder interfaces were examined using scanning electronmicroscopy and energy dispersive x-ray spectroscopy. The growth rate constants for each intermetallic layer were calculated assuming a simple parabolic diffusion-controlled growth model. The activation energy for Cu3Sn growth is 0.73 eV/atom and the activation energy for Cu6Sn5 growth is 1.11 eV/atom.
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收藏
页码：883 / 887
页数：5
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