Dielectric property and thermal stability of HfO2 on silicon

被引:236
作者
Lin, YS [1 ]
Puthenkovilakam, R [1 ]
Chang, JP [1 ]
机构
[1] Univ Calif Los Angeles, Dept Chem Engn, Los Angeles, CA 90095 USA
关键词
D O I
10.1063/1.1506207
中图分类号
O59 [应用物理学];
学科分类号
摘要
A stoichiometric, uniform, and amorphous hafnium oxide thin film is deposited by an atomic layer deposition process. The as-deposited hafnium oxide films showed superior electrical properties compared to zirconium oxides, including a dielectric constant of 23, a flatband voltage shift of +0.3 V, a hysteresis of 25 mV, an interfacial trap density of 1.8x10(11) cm(-2) eV(-1), and a leakage current density several orders of magnitude lower than SiO2 at an equivalent oxide thickness of 9.3 Angstrom, suitable for metal-oxide-semiconductor device applications. The thermal stability of hafnium oxide on silicon was determined to be better than that of zirconium oxide. Post-deposition annealing in oxygen and ammonia further improved the thermal stability of HfO2 to 1000 and 1100 degreesC, respectively. (C) 2002 American Institute of Physics.
引用
收藏
页码:2041 / 2043
页数:3
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