Investigation of the prediction model of IGBT junction temperature based on the rate of voltage change

被引:1
|
作者
Liu Bin-Li [1 ]
Tang Yong [1 ]
Luo Yi-Fei [1 ]
Liu De-Zhi [1 ]
Wang Rui-Tian [1 ]
Wang Bo [1 ]
机构
[1] Naval Univ Engn, Natl Key Lab Vessel Integrated Power Syst Technol, Wuhan 430033, Peoples R China
基金
美国国家科学基金会; 中国国家自然科学基金;
关键词
carrier concentration; carrier mobility; rate of voltage change; prediction model of junction temperature;
D O I
10.7498/aps.63.177201
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Based on semiconductor physics and the essential structure of insulated gate bipolar transistor (IGBT), the model of dV(CE)/dt is established through reasonable simplification and theoretical derivation. The influencing factors and temperature characteristics of dV(CE)/dt are studied in depth. It is concluded that dV(CE)/dt increases linearity with the increase of voltage or current, and decreases with the increase of junction temperature also linearly. On the basis of the model for dV(CE)/dt, the prediction model of junction temperature is established. Results of simulations and experiments verify the correctness and accuracy of the models. It is significant in theory and practical application for realizing IGBT junction temperature monitoring on-line and improving the reliability of IGBT module and power electronic equipment.
引用
收藏
页数:10
相关论文
共 21 条
  • [1] Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions
    Benmansour, A.
    Azzopardi, S.
    Martin, J. C.
    Woirgard, E.
    [J]. MICROELECTRONICS RELIABILITY, 2007, 47 (9-11) : 1730 - 1734
  • [2] Temperature-Level Effect on Solder Lifetime During Thermal Cycling of Power Modules
    Bouarroudj, Mounira
    Khatir, Zoubir
    Ousten, Jean-Pierre
    Lefebvre, Stphane
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2008, 8 (03) : 471 - 477
  • [3] Investigation Into IGBT dV/dt During Turn-Off and Its Temperature Dependence
    Bryant, Angus
    Yang, Shaoyong
    Mawby, Philip
    Xiang, Dawei
    Ran, Li
    Tavner, Peter
    Palmer, Patrick R.
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2011, 26 (10) : 3019 - 3031
  • [4] Chen M, 2012, ELECT MACHINES CONTR, V15, P44
  • [5] Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions
    Czerny, B.
    Lederer, M.
    Nagl, B.
    Trnka, A.
    Khatibi, G.
    Thoben, M.
    [J]. MICROELECTRONICS RELIABILITY, 2012, 52 (9-10) : 2353 - 2357
  • [6] A physics-based model of insulated gate bipolar transistor with all free-carrier injection conditions in base region
    Du Ming-Xing
    Wei Ke-Xin
    [J]. ACTA PHYSICA SINICA, 2011, 60 (10)
  • [7] [杜明星 Du Mingxing], 2010, [世界科技研究与发展, World Sci-Tech R and D], V32, P741
  • [8] Influences of polarization effect and p-region doping concentration on the photocurrent response of solar-blind p-i-n avalanche photodiodes
    Li Xiao-Jing
    Zhao De-Gang
    Jiang De-Sheng
    Liu Zong-Shun
    Chen Ping
    Wu Liang-Liang
    Li Liang
    Le Ling-Cong
    Yang Jing
    He Xiao-Guang
    Wang Hui
    Zhu Jian-Jun
    Zhang Shu-Ming
    Zhang Bao-Shun
    Yang Hui
    [J]. CHINESE PHYSICS B, 2014, 23 (02)
  • [9] Investigation into the turn-off mechanism and time of IGBT based on voltage and current
    Liu Bin-Li
    Liu De-Zhi
    Luo Yi-Fei
    Tang Yong
    Wang Bo
    [J]. ACTA PHYSICA SINICA, 2013, 62 (05)
  • [10] The Impact of Power Switching Devices on the Thermal Performance of a 10 MW Wind Power NPC Converter
    Ma, Ke
    Blaabjerg, Frede
    [J]. ENERGIES, 2012, 5 (07) : 2559 - 2577