Synchrotron X-ray topography of lattice undulation of bonded silicon-on-insulator wafers

被引:3
|
作者
Fukuda, K
Yoshida, T
Shimura, T
Yasutake, K
Umeno, M
机构
[1] Osaka Univ, Grad Sch Engn, Dept Mat & Life Sci, Suita, Osaka 5650871, Japan
[2] Fukui Univ Technol, Fac Engn, Dept Management Sci, Fukui, Fukui 9108585, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2004年 / 43卷 / 03期
关键词
silicon-on-insulator; synchrotron radiation; X-ray topography; lattice undulation; thin film; bonded SOI wafer;
D O I
10.1143/JJAP.43.1081
中图分类号
O59 [应用物理学];
学科分类号
摘要
Lattice undulation of Silicon-on-Insulator (SOI) layers of bonded SOI wafers was observed by synchrotron X-ray topography. Patterns observed on topographs depended on the thickness of the SOI layer, the camera distance between a specimen and an X-ray film. and the diffraction geometry of the Laue and Bragg cases. The dependence was interpreted as the effects of the geometrical relation in reciprocal space among the Ewald sphere, the reciprocal lattice vector, and the surface normal direction. To confirm the origin of the pattern formation, the topographic images were simulated in the framework of the kinematical diffraction theory. Based on the simulation, it was found that a granular pattern observed in the 115 Bragg case was due to the divergence/convergence effect of X-rays diffracted from the undulated SOI layer.
引用
收藏
页码:1081 / 1087
页数:7
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