Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs

被引:0
作者
Cernaj, L'. [1 ]
Chvala, A. [1 ]
Marek, J. [1 ]
Donoval, D. [1 ]
Zavodnik, T. [1 ]
Kozarik, J. [1 ]
Jagelka, M. [1 ,2 ]
Donoval, M. [2 ]
机构
[1] Slovak Univ Technol Bratislava, Fac Elect Engn & Informat Technol, Ilkovicova 3, Bratislava 81219, Slovakia
[2] Nanodesign Ltd, Drotarska 6385-19a, Bratislava 81104, Slovakia
来源
2018 12TH INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES AND MICROSYSTEMS (ASDAM) | 2018年
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暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Direct 3-D electrothermal equivalent model of power HEMT is presented in this paper. The model works with Synopsys HSPICE and 3-D RC network is build using MathWorks MATLAB. The thermal analysis of the multifinger power HEMT is performed. The features and limitations of the method are analysed and presented. Finite element method for thermal simulation usually uses separate simulation tool for thermal and electrical simulations. These tools must be properly synchronised and simulation is very time consuming for complicated 3-D structures. SPICE like circuit simulators are limited to electric models at a preselected temperature or the electrothermal feedback is provided only by an implemented simple single-pole RC equivalent network. Proposed method of 3-D electrothermal RC network combines simplicity of using only one simulation environment, while maintaining the accuracy of FEM. 3-D electrothermal RC network is built from a simplified structure of multifinger HEMT using Mathworks MATLAB script. This script allows us to build 3-D RC network for variety of physical dimensions and different number of fingers of HEMT.
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页码:175 / 178
页数:4
相关论文
共 4 条
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