共 25 条
[1]
Agonafer D., 2017, IEEE T COMPON PACKAG, V5, P737
[5]
A TRANSMISSION-LINE THEORY FOR HEAT-CONDUCTION IN MULTILAYER THIN-FILMS
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1994, 17 (03)
:426-434