Influence of layer structure on performance of AlGaN/GaN high electron mobility transistors before and after passivation

被引:4
作者
Bernát, J [1 ]
Javorka, P [1 ]
Fox, J [1 ]
Marso, M [1 ]
Kordos, P [1 ]
机构
[1] Inst Thin Films & Interfaces, ISG 1, Res Ctr Julich, D-52425 Julich, Germany
关键词
AlGaN/GaN high electron mobility transistor (HEMT); intentionally undoped and doped structure; passivation;
D O I
10.1007/s11664-004-0198-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Intentionally undoped and three different, doped layer structures are used to investigate properties of AlGaN/GaN high electron mobility transistors (HEMTs) before and after SiN passivation. For unpassivated devices, the drain current, transconductance, cutoff frequency, and microwave output-power increase with increased doping level, in spite of an increase in the gate-leakage current. After passivation, an overall performance improvement of all devices occurs. The passivation-induced sheet charge decreases from 2 X 10(12) cm(-2) in undoped structures to similar to0.7 X 10(12) cm(-2) in higher doped structures and performance improvement with passivation is less pronounced for higher doped devices. However, the output power of unpassivated and passivated devices on higher doped structures is much higher than that on the undoped-passivated counterpart. These results underline an advantage of the doped layer structure for the preparation of high-performance AlGaN/GaN HEMTs.
引用
收藏
页码:436 / 439
页数:4
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