Rapid coating of through-porous substrates by atomic layer deposition

A method is proposed for rapid coating of through-porous substrates by using atomic layer deposition (ALD). The method also demonstrated a new design for ALD reactor for uniform coating macroscopic through-porous substrates. The coating of substrates of through-porous media can be used for applications including 3D integrated circuits, printed circuit boards, electrodes for electrochemical applications, 3D capacitors, and X-ray optics. It was observed during study that the ALD process can provide high aspect ratio structures and macroscopically porous substrates. The study also found that the self-limiting growth mechanism can provide excellent conformality, large are uniformity, and accurate control of film thickness. The study concluded that the new ALD reactor design can be used for faster coating.