Gate oxide reliability of drain-side stresses compared to gate stresses

被引:9
作者
Dumin, NA [1 ]
Liu, KP [1 ]
Yang, SH [1 ]
机构
[1] Texas Instruments Inc, Silicon Technol Dev, Dallas, TX 75265 USA
来源
40TH ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM | 2002年
关键词
D O I
10.1109/RELPHY.2002.996612
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The gate oxide breakdown voltages of stresses applied to the gates of transistors are compared to the gate oxide breakdown voltages of stresses applied to the drains of transistors, The breakdown voltages for the drain-side stress are shown to be higher than the breakdown voltages for the gate stress. Using TCAD simulation data of a drain-side stress, the differences in breakdown voltages between the drain stresses and the gate stresses are compared to predictions of the gate oxide lifetime for various gate-stress and drain-stress cases.
引用
收藏
页码:73 / 78
页数:6
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