BEOL Compatible Superlattice FerroFET-based High Precision Analog Weight Cell with Superior Linearity and Symmetry

被引:30
作者
Aabrar, Khandker Akif [1 ]
Gomez, Jorge [1 ]
Kirtania, Sharadindu Gopal [1 ]
San Jose, Matthew [1 ]
Luo, Yandong [3 ]
Ravikumar, Priyankka G. [2 ]
Ravindran, Prasanna Venkatesan [3 ]
Ye, Huacheng [1 ]
Banerjee, Sanjukta [1 ]
Dutta, Sourav [1 ]
Khan, Asif Islam [3 ]
Yu, Shimeng [3 ]
Datta, Suman [1 ]
机构
[1] Univ Notre Dame, Notre Dame, IN 46545 USA
[2] Indian Inst Technol Palakkad, Palakkad 678623, Kerala, India
[3] Georgia Inst Technol, Atlanta, GA 30332 USA
来源
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2021年
关键词
D O I
10.1109/IEDM19574.2021.9720713
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Off-chip DRAM memory accesses limit the energy efficiency and training time of state-of-the-art deep neural networks (DNN). Compute-in-memory (CIM) accelerators leveraging pseudo-crossbar arrays and on-chip weight storage have emerged as alternatives to GPUs for fast and efficient training. However, this comes at the cost of reduced training accuracy due to weight cell non-idealities such as: low bit precision, nonlinearity, asymmetry, low G(max)/G(min) ratio, and slow programming speed. Here, we engineer the ferroelectric domain structure in a carefully designed superlattice (SL) ferroelectric(FE)/dielectric(DE) stack, to experimentally demonstrate high precision FEFET analog weight cells with excellent linearity and symmetry during potentiation and depression. We demonstrate switching speed as low as 100 ns in the SL-based ferroelectric capacitor (FECAP), with no degradation in either retention or endurance. We integrate the SL FE/DE/FE with a back-end-of-line (BEOL) compatible Indium Tungsten Oxide transistors, to demonstrate 128 stable conductance states with improved linearity and symmetry. System-level analysis of SL-FEFET based CIM accelerators show an excellent 94.1% online learning accuracy without degrading any other performance parameter, with potential for monolithic 3D integration.
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页数:4
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