Thermal Analysis of Modified Pin Fin Heat Sink for Natural Convection

被引：0

作者：

Arefin, Amit Md. Estiaque ^{[1
]}

机构：

[1] Rajshahi Univ Engn & Technol, Dept Mech Engn, Rajshahi, Bangladesh

来源：

2016 5TH INTERNATIONAL CONFERENCE ON INFORMATICS, ELECTRONICS AND VISION (ICIEV) | 2016年

关键词：

electronics; electronic component; heat sink; fin; thermal analysis; natural convection; solidworks; finite element method; PLATE-FIN; PERFORMANCE; ARRAYS; OPTIMIZATION; RADIATION; DESIGN;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Heat sinks are often considered to be the cheapest, the simplest and the best solution for the thermal problems of electronic components. In this paper, a modified pin design is introduced for pin fin heat sink where the pins are expanded outward. After that, thermal analysis of the conventional pin fin heat sink and the modified pin fin heat sink is conducted numerically for natural convection for circular shape in inline arrangement assuming steady state condition. The modified pin fin heat sink is observed to perform better than the conventional one. For this numerical thermal analysis, finite element method is used with the help of Solidworks.

引用

页码：1 / 5

页数：5

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