Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders

被引：81

作者：

Dudek, M. A. ^{[1
]}

Chawla, N. ^{[1
]}

机构：

[1] Arizona State Univ, Fulton Sch Engn, Sch Mat, Tempe, AZ 85287 USA

来源：

ACTA MATERIALIA | 2009年 / 57卷 / 15期

关键词：

Whiskers; Focused ion beam (FIB); 3-D materials science; TIN WHISKERS; SURFACE; BEHAVIOR;

D O I：

10.1016/j.actamat.2009.06.031

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

It has recently been documented that Pb-free solder alloys doped with trace amounts of rare earth (RE) elements show a very strong propensity to grow Sri whiskers. In this work, we have investigated the effect of the addition of 2 wt.% Ce, La or Y on the whiskering behavior of Sn-3.9Ag-0.7Cu. Hillock-type whiskers around particle peripheries were observed in water-quenched alloys with smaller RESn3 particles, while furnace-cooled alloys with larger RESn3 particles formed needle-like whiskers from within the particle. Phase separation between Sn and RE oxides occurred during oxidation of the RESn3 intermetallics. A focused ion beam serial sectioning approach was used to visualize the Sn whiskers and the oxide structure. We show that the driving force for whisker growth is related to the compressive stresses that develop in these particles during the oxidation of the RE intermetallic phases. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：4588 / 4599

页数：12

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