Simulation of switching noise in multi-layer structures using generalized transmission line equation method

被引:0
|
作者
Wan, LX [1 ]
Swaminathan, M [1 ]
Tummala, RR [1 ]
机构
[1] Georgia Inst Technol, Package Res Ctr, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源
2002 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, SYMPOSIUM RECORD | 2002年
关键词
Generalized Transmission Line Equation; switching noise; multi-layer structure;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper discusses the use of the Generalized Transmission Line Equations (GTLE) for the simulation of switching noise distribution in multi-layered packaging structures. After a brief discussion on the formulation and its application to a simple dual trace transmission line, two-layered plane and two-layered plane with four drivers and traces, the method has been applied to a complicated fourteen-layer structure which consists of the pack-age and board power distribution. This structure includes non-ideal decoupling capacitors placed on the package/board, vias connecting the planes, drivers and traces. This paper demonstrates the advantage of the GTLE method over SPICE in terms of efficiency and accuracy. In addition, this paper provides insight into the noise mechanism arising in multi-layered power distribution networks.
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页码:1026 / 1031
页数:6
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