Thermal and mechanical design of tangential hybrid microchannel and high-conductivity inserts for cooling of disk-shaped electronic components

The efficiency of electronic equipment is the cornerstone of technology development. Thermal conditions significantly affect the performance of electronic components. Moreover, mechanical strength, size, and mass are the parameters that impose some limitations. Thus, they should be considered in the high tech industry. Therefore, it is needed to examine both mechanical and thermal behaviors simultaneously. Microchannel and inserted high-conductivity materials are two usual cooling approaches. To improve cooling efficiency and mechanical strength, a new method named Hybrid is introduced here. This method is a combination of microchannel and high-conductivity methods. In this study, the consumed energy, the conductivity ratio of the material with high conductivity, peak temperature, and maximum Von Mises stress have been investigated and analyzed. For the hybrid method, the peak temperature and stress were minimized regarding the volume of high-conductivity change in the tangential direction of the duct. The results showed that the tangential hybrid method could decrease the peak temperature and peak Von Mises stress, up to 40% and 34% in comparison to the microchannel and high-conductivity inserts method.