High-fluence Co implantation in Si, SiO2/Si and Si3N4/Si Part III:: heavy-fluence Co bombardment induced surface topography development

被引:6
作者
Zhang, YW
Winzell, T
Zhang, TH
Maximov, IA
Sarwe, EL
Graczyk, M
Montelius, L
Whitlow, HJ
机构
[1] Lund Inst Technol, Dept Phys Nucl, S-22100 Lund, Sweden
[2] Beijing Normal Univ, Inst Low Energy Nucl Phys, Beijing 100875, Peoples R China
[3] Lund Inst Technol, Dept Solid State Phys, S-22100 Lund, Sweden
关键词
surface topography; sputtering; scanning electron microscopy (SEM); silicon; oxide; nitride;
D O I
10.1016/S0168-583X(99)00539-X
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
The surface topography development of Si(1 0 0), Si(1 1 1), oxide/Si and nitride/Si structures under high normal fluence (1 x 10(16)-2.6 x 10(18) ions cm(-2)) keV Co metal vapour vacuum are (MEVVA) irradiation has been investigated by scanning electron microscopy (SEM). The results show that for normal fluences up to similar to 10(17) ions cm(-2), the surface topography remains flat. As the fluence increases, pores develop and grow to form a columnar structure. At even higher fluences the columns are eroded to form an acicular structure. Deposition of a silicon dioxide or nitride layer on the Si surface leads to a significant suppression of the onset fluence for the formation of a rough surface. The porous surface could not be transformed to the network of acicular structures or a flat surface by high temperature annealing. (C) 1999 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:158 / 165
页数:8
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