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- [1] Thermal cycling aging effects on the tensile property of lead-free solder Sn-3Ag-0.5Cu 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 708 - 711
- [4] Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cu solder 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 452 - 455
- [6] Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition Journal of Electronic Materials, 2011, 40 : 344 - 354
- [10] Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bumping for Sub-100 μm size solder bumps Metals and Materials International, 2013, 19 : 1083 - 1090