Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications

被引：53

作者：

Park, Jongbae ^{[1
]}

Lu, Albert Chee W.

Chua, Kai M.

Wai, Lai L.

Lee, Junho

Kim, Joungho

机构：

[1] Korea Adv Inst Sci & Technol, Dept Elect Engn, Taejon 305701, South Korea

[2] Singapore Inst Mfg Technol, Singapore 638075, Singapore

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2006年 / 16卷 / 09期

关键词：

double-stacked EBG; electromagnetic bandgap (EBG); low-temperature co-fired ceramic (LTCC); mixed-signal system; simultaneous switching noise (SSN); SSN coupling; system-in-package (SiP);

D O I：

10.1109/LMWC.2006.880719

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We propose a novel electromagnetic bandgap (EBG) structure with a significantly extended noise isolation bandwidth, called a double-stacked EBG (DS-EBG) structure, fabricated on a low-temperature co-fired ceramic (LTCC) multilayer substrate. The DS-EBG structure was devised for wideband suppression of simultaneous switching noise (SSN) coupling in system-in-package (SiP) applications. Our design approach was enabled by combining two EBG layers embedded between the power and ground planes. The two EBG layers had different bandgaps from using different cell sizes. Enhanced wideband suppression of the SSN coupling was validated using a 11.4-GHz noise stop bandwidth with 30-dB isolation in time and frequency domain measurements up to 20 GHz.

引用

页码：481 / 483

页数：3

共 9 条

[1] Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits [J].

Abhari, R ;

Eleftheriades, GV .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (06) :1629-1639

[2] A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface [J].

Kamgaing, T ;

Ramahi, OM .

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2003, 13 (01) :21-23

[3]

Lee J., 2003, IEEE MICROW WIRELESS, V15, P505

[4] Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes [J].

Rogers, SD .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2005, 53 (08) :2495-2505

[5] Simultaneous switching noise mitigation in PCB using cascaded high-impedance surfaces [J].

Shahparnia, S ;

Ramahi, OM .

ELECTRONICS LETTERS, 2004, 40 (02) :98-100

[6] Miniaturised electromagnetic bandgap structures for broadband switching noise suppression in PCBs [J].

Shahparnia, S ;

Ramahi, OM .

ELECTRONICS LETTERS, 2005, 41 (09) :519-520

[7] High-impedance surfaces embedded in printed circuit boards: Design considerations and novel applications [J].

Shahparnia, S ;

Ramahi, OM .

IEEE ANTENNAS AND PROPAGATION SOCIETY SYMPOSIUM, VOLS 1-4 2004, DIGEST, 2004, :3569-3572

[8]

SHAHPARNIA S, 2004, P IEEE 13 TOP M EL P, P211

[9] The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade [J].

Tummala, RR ;

Swaminathan, M ;

Tentzeris, MM ;

Laskar, J ;

Chang, GK ;

Sitaraman, S ;

Keezer, D ;

Guidotti, D ;

Huang, ZR ;

Lim, K ;

Wan, LX ;

Bhattacharya, SK ;

Sundaram, V ;

Liu, FH ;

Raj, PM .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (02) :250-267

← 1 →