CMOS-MEMS technology with front-end surface etching of sacrificial SiO2 dedicated for acoustic devices

被引：0

作者：

Esteves, J. ^{[1
]}

Rufer, L. ^{[1
]}

Basrour, S. ^{[1
]}

Ekeom, D. ^{[2
]}

机构：

[1] UJF, TIMA Lab, CNRS, G INP, Grenoble, France

[2] Microson, St Etienne, France

来源：

2013 5TH IEEE INTERNATIONAL WORKSHOP ON ADVANCES IN SENSORS AND INTERFACES (IWASI) | 2013年

关键词：

CMOS-MEMS Technology; Acoustic MEMS; Front-end Surface Etching; CONDENSER MICROPHONE; MODEL; VOLTAGE;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, we will present results showing a feasibility of a MEMS microphone, based on AMS 0.35 mu m CMOS standard process, with only one step of a sacrificial SiO2 maskless etching on the substrate front-side. The microphone design, modeling and simulated performance will be stud Fabrication of test structures obtained with a SiO2 shown as well as characterizations of these test structures.

引用

页码：154 / 159

页数：6

共 17 条

[1] Squeeze film air damping in MEMS
Bao, Minhang
Yang, Heng
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 2007, 136 (01) : 3 - 27
[2] Cheng X., 2009, 15th International Conference on Solid-State Sensors, Actuators and Microsystems. Transducers 2009, P1222, DOI 10.1109/SENSOR.2009.5285878
[3] A maskless wet etching silicon dioxide post-CMOS process and its application
Dai, Ching-Liang
[J]. MICROELECTRONIC ENGINEERING, 2006, 83 (11-12) : 2543 - 2550
[4] An integrated tunable band-pass filter using MEMS parallel-plate variable capacitors implemented with 0.35μm CMOS technology
Fouladi, S.
Bakri-Kassem, M.
Mansour, R. R.
[J]. 2007 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-6, 2007, : 505 - 508
[5] Ganji BA, 2011, CRYSTALLINE SILICON - PROPERTIES AND USES, P313
[6] Analytical model for viscous damping and the spring force for perforated planar microstructures acting at both audible and ultrasonic frequencies
Homentcovschi, Dorel
Miles, Ronald N.
[J]. JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 2008, 124 (01) : 175 - 181
[7] Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate
Huang, Chien-Hsin
Lee, Chien-Hsing
Hsieh, Tsung-Min
Tsao, Li-Chi
Wu, Shaoyi
Liou, Jhyy-Cheng
Wang, Ming-Yi
Chen, Li-Che
Yip, Ming-Chuen
Fang, Weileun
[J]. SENSORS, 2011, 11 (06): : 6257 - 6269
[8] A 1.8 V 828 μW 80 dB digital MEMS microphone
Jawed, Syed Arsalan
Cattin, Davide
Massari, Nicola
Gottardi, Massimo
Baschirotto, Andrea
[J]. ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2011, 67 (03) : 395 - 405
[9] Mohamad N., 2008, P SPIE INT SOC OPTIC, V6800
[10] Analytical solutions for the stiffness and damping coefficients of squeeze films in MEMS devices with perforated back plates
Mohite, SS
Kesari, H
Sonti, VR
Pratap, R
[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2005, 15 (11) : 2083 - 2092

← 1 2 →