Influence of imidazole and benzotriazole on electroless copper plating

被引：15

作者：

Balaramesh, P. ^{[1
]}

Venkatesh, P. ^{[2
]}

Rekha, S. ^{[3
]}

机构：

[1] RMK Engn Coll, Chennai, Tamil Nadu, India

[2] Pachaiyappas Coll, Chennai, Tamil Nadu, India

[3] RMD Engn Coll, Chennai, Tamil Nadu, India

来源：

SURFACE ENGINEERING | 2014年 / 30卷 / 08期

关键词：

Copper deposits; Crystal structure; Saccharose; Surface morphology; Xylitol; DEPOSITION;

D O I：

10.1179/1743294414Y.0000000281

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In this study, the effect of imidazole and benzotriazole as primary stabilisers in saccharose and xylitol based copper electroless baths were studied. Copper methane sulphate was used as the complexing agent instead of copper sulphate and para formaldehyde was used as the reducing agent in the bath. The surface morphologies of copper deposits were characterised by SEM, AFM and XRD studies. The electrochemical characteristics were studied by cyclic voltametry to understand the role of the stabilisers in electroless deposition. In the saccharose bath, the imidazole and benzotriazole acted as inhibitors and best deposition was obtained at pH of 12.75. Benzotriazole afforded smoother and shiner deposits than imidazole. In xylitol bath, the stabilizers acted as accelerators and optimum deposition occurred at a pH of 13.25.

引用

页码：552 / 556

页数：5

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