共 32 条
Optimal thermal design of a horizontal fin heat sink with a modified-opening model mounted on an LED module
被引:39
作者:

Jeong, Min Woo
论文数: 0 引用数: 0
h-index: 0
机构:
Korea Univ, Dept Mech Engn, Seoul 136701, South Korea Korea Univ, Dept Mech Engn, Seoul 136701, South Korea

Jeon, Seung Won
论文数: 0 引用数: 0
h-index: 0
机构:
Korea Univ, Dept Mech Engn, Seoul 136701, South Korea Korea Univ, Dept Mech Engn, Seoul 136701, South Korea

Kim, Yongchan
论文数: 0 引用数: 0
h-index: 0
机构:
Korea Univ, Dept Mech Engn, Seoul 136701, South Korea Korea Univ, Dept Mech Engn, Seoul 136701, South Korea
机构:
[1] Korea Univ, Dept Mech Engn, Seoul 136701, South Korea
基金:
新加坡国家研究基金会;
关键词:
Light emitting diode (LED);
Fin heat sink;
Opening;
Thermal design optimization;
Natural convection;
ENHANCEMENT;
DISSIPATION;
OPTIMIZATION;
PERFORMANCE;
CHIP;
D O I:
10.1016/j.applthermaleng.2015.08.001
中图分类号:
O414.1 [热力学];
学科分类号:
摘要:
Effective cooling is very important issue in a light emitting diode (LED) module because its performance and reliability decrease significantly as the junction temperature increases. This study proposes a cooling method that improves upon the poor ventilation and heat dissipation of a horizontal fin heat sink mounted on an LED module with natural convection. Response surface methodology (RSM) was used to optimize the geometry of the horizontal fin heat sink with the modified openings, and the cooling performance of the proposed model was compared against those of conventional fin heat sinks. The total thermal resistance of the proposed model is decreased by 30.5% relative to that of the conventional no-opening model at an orientation of 1800 and a heat input of 10 W. In addition, the luminous efficacy of the proposed model is increased by 23.7% relative to that of the conventional no-opening model at an orientation of 1800 and a heat input of 25 W. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:105 / 115
页数:11
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