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Kinetics of cationic photopolymerizations of UV-curable epoxy-based SU8-negative photoresists with and without silica nanoparticles
被引:42
作者:
Cho, Jung-Dae
Ju, Hyoung-Tae
Park, Young-Sik
Hong, Jin-Who
机构:
[1] Q Sys Co Ltd, Inst Photon & Surface Treatment, Kwangju 500460, South Korea
[2] Chosun Univ, Dept Polymer Sci & Engn, Kwangju 501759, South Korea
[3] Korea Photon Technol Inst, Kwangju 500460, South Korea
关键词:
cationic polymerization;
kinetics;
negative photoresist;
photo-DSC;
silica nanoparticles;
D O I:
10.1002/mame.200600124
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
This paper reports on the photocuring kinetics of protonic-acid-initiated cationic polymerizations of UV-curable epoxy-based SU8-negative photoresist systems with and without silica nanoparticles, as assessed using photo-DSC, FTIR spectroscopy, UV-vis spectroscopy, and SEM. Photo-DSC analysis using an autocatalytic kinetic model demonstrated that the cross-link density and cure rate increased as the concentration of silica nanoparticles with surface silanol groups increased to 2.5 wt.-%. This result was confirmed by FTIR spectroscopy, and suggests that the presence of silica nanoparticles of up to 2.5 wt.-% promoted the cure conversion and cure rate of the UV-curable hybrid organic/inorganic negative photoresists due to the synergistic effect of silica nanoparticles acting both as an effective flow or diffusion-aid agent and as a proton-donor cocatalyst during the cationic photopolymerization process. The decrease in the cross-link density that occurred when the silica content was higher than 2.5 wt.-% was attributed to aggregation between silica nanoparticles due to their high surface energy.
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页码:1155 / 1163
页数:9
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