An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys

被引：0
|
作者：
Sun, Haiqing [1 ]
Shi, Yinong [1 ]
机构：
[1] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY | 2009年 / 25卷 / 03期
关键词：
Nanomaterials; Mechanical properties; Hardness; STRAIN-RATE SENSITIVITY; MECHANICAL-BEHAVIOR; THERMAL-STABILITY; PLASTIC-DEFORMATION; STRENGTH; METALS; COPPER; MICROSTRUCTURE; DUCTILITY; EVOLUTION;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Nanocrystalline Cu-Ni-P alloys with average grain sizes of 7, 10 and 24 nm were synthesized by means of electrodeposition. The grain size dependences of tensile strength and hardness of the nanocrystalline Cu alloys were investigated. The breakdown of Hall-Petch relation was exhibited in both tensile strength and hardness.
引用
收藏
页码：347 / 350
页数：4
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