Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints

被引：71

作者：

Wiese, S ^{[1
]}

Feustel, F ^{[1
]}

Meusel, E ^{[1
]}

机构：

[1] Tech Univ Dresden, Inst Halbleiter & Mikrosyst Tech, D-01062 Dresden, Germany

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2002年 / 99卷 / 1-2期

关键词：

SnAg; SnAgCu; SnPb; constitutive behaviour; lead-free solder; flip chip;

D O I：

10.1016/S0924-4247(01)00880-9

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The constitutive behaviour of Sn96.5Ag3.5, Sn95.5Ag4Cu0.5 and Sn63Pb37 solder was investigated on ultra small flip chip solder joints (V = 1 X 10(-11) m(3)). In order to run experiments on these small specimens, a micro shear tester has been designed. The tester is optimised to achieve high precision. It is able to record force displacement hysteresis with a resolution of better than 1 mN and 20 nm. for force and displacement measurements, respectively. It was found that the creep behaviour of the lead-free solders exhibit a very high dependence on stress (Sn96.5Ag3.5: n = 11; Sn95.5Ag4Cu0.5: n = 18), while the eutectic SnPb showed a low stress dependence of n = 2. (C) 2002 Elsevier Science B.V All rights reserved.

引用

页码：188 / 193

页数：6

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