Measurement of the displacement field around an edge dislocation in silicon to 3 pm by high-resolution electron microscopy

被引:0
|
作者
Hÿtch, MJ
Putaux, JL
Pénisson, JM
机构
[1] CNRS, CECM, F-94407 Vitry Sur Seine, France
[2] CNRS, CERMAV, F-38041 Grenoble 9, France
[3] DRFMC, SP2M, ME, CEAG, F-38054 Grenoble, France
来源
MICROSCOPY OF SEMICONDUCTING MATERIALS 2003 | 2003年 / 180期
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中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The aim of the present work is to establish HREM as a tool for measuring strain in semiconductors and devices at the nanometre scale. To this end, we have measured the displacement field around a known object, a pure-edge dislocation in silicon, and compared results with elastic theory. Measurements were carried out using the geometric phase technique, including careful calibration of projector lens distortions. The continuous displacement field was calculated using full anisotropic elastic theory. Agreement with theory, in directions both perpendicular and parallel to the Burgers vector, will be shown to be better than 0.03 Angstrom or 3 pm. Accuracy - in this case, almost a hundred times the resolution of the instrument used - results from improved methodology and specimen preparation.
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页码:11 / 14
页数:4
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