Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate

被引：10

作者：

Liu, Xiaoying ^{[1
]}

Huang, Mingliang ^{[1
]}

Zhao, Ning ^{[1
]}

Wang, Lai ^{[1
]}

机构：

[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2014年 / 25卷 / 01期

基金：

中国国家自然科学基金;

关键词：

LEAD-FREE SOLDERS; INTERMETALLIC COMPOUNDS; SN-3.5AG SOLDER; SNAGCU SOLDER; GROWTH; ALLOY; MICROSTRUCTURE; MORPHOLOGY; DIFFUSION; JOINTS;

D O I：

10.1007/s10854-013-1590-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The growth kinetics and morphology of the interfacial intermetallic compound (IMC) between Sn-3Ag-0.5Cu-xFe (x = 0, 0.5 wt%, 1 wt%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 A degrees C and then aged at 150 A degrees C. During soldering process, Fe particles quickly deposited in the vicinity of IMC, resulting in the formation of Fe-rich area. Isothermal equation of chemical reaction and phase diagrams were used to explain the effect of Fe on the growth kinetics of IMC during liquid-state interfacial reaction. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains after reflowing for 2 min while they were found in the other composite solders reflowing for about 30 min. The Fe tended to suppress the growth of the Cu3Sn layer during solid-state aging. However, the total thickness of IMCs (Cu6Sn5 + Cu3Sn) for the composite solders with Fe particles was similar to that for SnAgCu without Fe particles.

引用

页码：328 / 337

页数：10

共 24 条

[1] Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or Co [J].

Cheng, Fangjie ;

Nishikawa, Hiroshi ;

Takemoto, Tadashi .

JOURNAL OF MATERIALS SCIENCE, 2008, 43 (10) :3643-3648

[2] Effect of thermal aging on board level drop reliability for Pb-free BGA packages [J].

Chiu, TC ;

Zeng, KJ ;

Stierman, R ;

Edwards, D ;

Ano, K .

54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, :1256-1262

[3] Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate [J].

Choi, WK ;

Lee, HM .

JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) :1207-1213

[4] Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing [J].

Gao, F ;

Takemoto, T ;

Nishikawa, H .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 420 (1-2) :39-46

[5] Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate [J].

Gong, Jicheng ;

Liu, Changqing ;

Conway, Paul P. ;

Silberschmidt, Vadim V. .

SCRIPTA MATERIALIA, 2009, 60 (05) :333-335

[6] On the mechanism of the binary Cu/Sn solder reaction -: art. no. 053106 [J].

Görlich, J ;

Schmitz, G ;

Tu, KN .

APPLIED PHYSICS LETTERS, 2005, 86 (05) :1-3

[7] Interfacial reaction issues for lead-free electronic solders [J].

Ho, C. E. ;

Yang, S. C. ;

Kao, C. R. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) :155-174

[8] Microstructure of a lead-free composite solder produced by an in-situ process [J].

Hwang, SY ;

Lee, JW ;

Lee, ZH .

JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) :1304-1308

[9] Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening [J].

Kim, HK ;

Tu, KN .

PHYSICAL REVIEW B, 1996, 53 (23) :16027-16034

[10] Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu [J].

Kim, KS ;

Huh, SH ;

Suganuma, K .

MICROELECTRONICS RELIABILITY, 2003, 43 (02) :259-267

← 1 2 3 →