Advancing the thermal stability of 3D ICs using logi-thermal simulation

被引：18

作者：

Nagy, Gergely ^{[1
]}

Horvath, Peter ^{[2
]}

Pohl, Laszlo ^{[2
]}

Poppe, Andras ^{[2
]}

机构：

[1] NNG Kft, H-1037 Budapest, Hungary

[2] Budapest Univ Technol & Econ, Dept Electron Devices, H-1117 Budapest, Hungary

来源：

MICROELECTRONICS JOURNAL | 2015年 / 46卷 / 12期

关键词：

Logi-thermal simulation; 3D IC; Stacked-die;

D O I：

10.1016/j.mejo.2015.06.025

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

3D ICs have emerged in the past few years. While they solve a large number of problems related to scaling, they also create new ones. Removing the heat from the layers far from the cooling facilities is a great challenge still under intensive research. This paper shows how logi-thermal simulation can be used to predict the operation parameters of large digital systems realized in 3D ICs. The method can be effectively used to guide place-and-route algorithms and to find the thermal bottlenecks. (C) 2015 Elsevier Ltd. All rights reserved.

引用

页码：1114 / 1120

页数：7

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