Advancing the thermal stability of 3D ICs using logi-thermal simulation

被引：18
作者：
Nagy, Gergely [1 ]
Horvath, Peter [2 ]
Pohl, Laszlo [2 ]
Poppe, Andras [2 ]
机构：
[1] NNG Kft, H-1037 Budapest, Hungary
[2] Budapest Univ Technol & Econ, Dept Electron Devices, H-1117 Budapest, Hungary
来源：
MICROELECTRONICS JOURNAL | 2015年 / 46卷 / 12期
关键词：
Logi-thermal simulation; 3D IC; Stacked-die;
D O I：
10.1016/j.mejo.2015.06.025
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
3D ICs have emerged in the past few years. While they solve a large number of problems related to scaling, they also create new ones. Removing the heat from the layers far from the cooling facilities is a great challenge still under intensive research. This paper shows how logi-thermal simulation can be used to predict the operation parameters of large digital systems realized in 3D ICs. The method can be effectively used to guide place-and-route algorithms and to find the thermal bottlenecks. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1114 / 1120
页数：7
相关论文
共 20 条
  • [1] Cheng H. C., 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), P370, DOI 10.1109/IMPACT.2012.6420271
  • [2] Chih-Hao Chao, 2010, 2010 ACM/IEEE International Symposium on Networks-on-Chip (NOCS), P223, DOI 10.1109/NOCS.2010.32
  • [3] Handling inverted temperature dependence in static timing analysis
    Dasdan, Ali
    Hom, Ivan
    [J]. ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2006, 11 (02) : 306 - 324
  • [4] Demidovich B.P., 1973, COMPUTATIONAL MATH, P459
  • [5] Falkenstern P, 2010, ASIA S PACIF DES AUT, P166
  • [6] Horvath P., 2015, P DES TEST INT PACK, P136
  • [7] A proposed synthesis method for Application-Specific Instruction Set Processors
    Horvath, Peter
    Hosszu, Gabor
    Kovacs, Ferenc
    [J]. MICROELECTRONICS JOURNAL, 2015, 46 (03) : 237 - 247
  • [8] Hung WL, 2006, ISQED 2006: PROCEEDINGS OF THE 7TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, P98
  • [9] James D, 2014, ASMC PROC, P113, DOI 10.1109/ASMC.2014.6846988
  • [10] Reversed temperature-dependent propagation delay characteristics in nanometer CMOS circuits
    Kumar, Ranjith
    Kursun, Volkan
    [J]. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2006, 53 (10) : 1078 - 1082
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