Arbitrary 3D linewidth form measurement simulations for the next-generation semiconductor circuits by scatterometry using the FDTD method

被引:10
作者
Shirasaki, H [1 ]
机构
[1] Tamagawa Univ, Dept Elect Engn, Machida, Tokyo 1948610, Japan
来源
METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVIII, PTS 1 AND 2 | 2004年 / 5375卷
关键词
semiconductor; silicon; trench; shape measurements; FDTD method; scatterometry;
D O I
10.1117/12.533579
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper shows basic numerical data for measuring the double periodic linewidths in the complicated LSI circuits using lightwaves. The double periodic areas, containing contact holes, memory arrays, and the mazy and arbitrary line structures are hard to analyze by the RCWA(rigorous coupled wave analysis). Therefore we analyze them using the finite-difference time-domain (FDTD) method. The 3D FDTD analysis is explained in this paper. The reflected electromagnetic waves in the near fields are obtained by the vertical plane wave incidences. The far field solutions are calculated using the numerical integration of the near field currents and the magnetic currents. Then, the scatterometry characteristics can be calculated as a far field by superimposing the scattering electromagnetic fields in a periodic reference surface (a square or rectangular region). Finally, we confirm the FDTD analysis is effective to obtain the reflected light characteristics close to the complicated real photolithographic models.
引用
收藏
页码:1339 / 1345
页数:7
相关论文
共 12 条
  • [1] ALJUMAILY GA, 1999, OPTICAL METROLOGY, pCH3
  • [2] [Anonymous], INT TECHNOLOGY ROADM
  • [3] Optical digital profilometry applications on contact holes
    Bischoff, J
    Niu, XH
    Jakatdar, N
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVII, PTS 1 AND 2, 2003, 5038 : 1080 - 1088
  • [4] RANCOURT JD, 1996, OPTICAL THIN FILMS U, pCH1
  • [5] Resist and silicon trench array linewidth measurement simulations for the next-generation semiconductor circuits by optical scattering properties using the FDTD method
    Shirasaki, H
    Ueta, K
    Kondou, N
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVII, PTS 1 AND 2, 2003, 5038 : 748 - 756
  • [6] Shape measurement simulation for the silicon trench array by scattering properties and continuous wavelet analysis with interference spectroscopy
    Shirasaki, H
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVI, PTS 1 & 2, 2002, 4689 : 688 - 695
  • [7] SULLIVAN DM, 2000, ELECTROMAGNETIC SIMU, pCH4
  • [8] TAFLOVE A, 2000, FINITE DIFFERENCE TI, pCH11
  • [9] TAFLOVE A, 2000, FINITE DIFFERENCE TI, pCH3
  • [10] TAFLOVE A, 2000, FINITE DIFFERENCE TI, pCH13