Reliability of tin-lead balled BGAs soldered with lead-free solder paste

被引：13

作者：

Nurmi, ST ^{[1
]}

Ristolainen, EO ^{[1
]}

机构：

[1] Tampere Univ Technol, Elect Lab, FIN-33101 Tampere, Finland

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2002年 / 14卷 / 02期

关键词：

lead-free; temperature cycling; ball grid array;

D O I：

10.1108/09540910210427808

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper will describe tests of the interconnect reliability of BGA components with tin-lead bumps soldered with lead-free solder paste during temperature cycling. Tin-lead BGA components soldered with tin-lead solder paste and lead-free BGA components soldered with lead-free solder paste were used as a reference. The lead-free solder used was eutectic tin-silver-copper, Two kinds of surface finishes were used on the printed circuit boards (PCB), an immersion gold over electroless nickel and an organic solderability preservative. The test PCBs were temperature-cycled for 2500 cycles in the range of - 40degreesC to + 125degreesC and they were continuously electrically monitored during the cycling. The results of the temperature cycling test showed that lead-containing BGA components soldered with lead-free solder paste don't show any serious reliability risks and can actually withstand temperature cycling stresses better than entirely lead-free BGA assemblies.

引用

页码：35 / 39

页数：5

共 12 条

[1]

Coyle RJ, 2000, ELEC COMP C, P160

[2] Influence of interfacial reaction on reliability of QFP joints with Sn-Ag based Pb free solders [J].

Hirose, A ;

Fujii, T ;

Imamura, T ;

Kobayashi, KF .

MATERIALS TRANSACTIONS, 2001, 42 (05) :794-802

[3]

Jacobson DM, 1997, GEC J TECHNOL, V14, P98

[4] Lead-free bump interconnections for flip-chip applications [J].

Karim, ZS ;

Schetty, R .

TWENTY SIXTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, PROCEEDINGS, 2000, :274-278

[5]

Lau J., 1997, SOLDER JOINT RELIABI

[6]

Lee SWR, 2000, ELEC COMP C, P868, DOI 10.1109/ECTC.2000.853264

[7] Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect [J].

Levis, KM ;

Mawer, A .

50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, :1198-1204

[8] Shear property and microstructure evaluation of Pb-free solder bumps under room temperature and multiple reflow/high temperature aging [J].

Li, L ;

Jang, JW ;

Allmen, B .

INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, :347-353

[9] Pb-free solder paste reflow window study for flip chip wafer bumping [J].

Li, L ;

Rao, Y ;

Lin, JK .

INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, :112-118

[10]

Strauss R., 1998, SMT Soldering Handbook

← 1 2 →