Stress controlled pulsed direct current co-sputtered Al1-xScxN as piezoelectric phase for micromechanical sensor applications

被引:82
作者
Fichtner, Simon [1 ]
Reimer, Tim [1 ,2 ]
Chemnitz, Steffen [1 ,2 ]
Lofink, Fabian [2 ]
Wagner, Bernhard [1 ,2 ]
机构
[1] Univ Kiel, Inst Mat Sci, D-24143 Kiel, Germany
[2] Fraunhofer Inst Silicon Technol, D-25524 Itzehoe, Germany
关键词
THIN-FILMS; MEMS;
D O I
10.1063/1.4934756
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Scandium alloyed aluminum nitride (Al1-xScxN) thin films were fabricated by reactive pulsed direct current co-sputtering of separate scandium and aluminum targets with x <= 0.37. A significant improvement of the clamped transversal piezoelectric response to strain e(31,f) from -1.28 C/m(2) to -3.01 C/m(2) was recorded, while dielectric constant and loss angle remain low. Further, the built-in stress level of Al1-xScxN was found to be tuneable by varying pressure, Ar/N-2 ratio, and Sc content. The thus resulting enhancement of the expectable signal to noise ratio by a factor of 2.1 and the ability to control built-in stress make the integration of Al1-xScxN as the piezoelectric phase of micro-electro-mechanical system sensor applications highly attractive. (C) 2015 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution 3.0 Unported License.
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页数:6
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