Robust Adhesive Precision Bonding in Automated Assembly Cells

Diode lasers are gaining importance, making their way to higher output powers along with improved BPP. The assembly of micro-optics for diode laser systems goes along with the highest requirements regarding assembly precision. Assembly costs for micro-optics are driven by the requirements regarding alignment in a submicron and the corresponding challenges induced by adhesive bonding. For micro-optic assembly tasks a major challenge in adhesive bonding at highest precision level is the fact, that the bonding process is irreversible. Accordingly, the first bonding attempt needs to be successful. Today's UV-curing adhesives inherit shrinkage effects crucial for submicron tolerances of e. g. FACs. The impact of the shrinkage effects can be tackled by a suitable bonding area design, such as minimal adhesive gaps and an adapted shrinkage offset value for the specific assembly parameters. Compensating shrinkage effects is difficult, as the shrinkage of UV-curing adhesives is not constant between two different lots and varies even over the storage period even under ideal circumstances as first test results indicate. An up-to-date characterization of the adhesive appears necessary for maximum precision in optics assembly to reach highest output yields, minimal tolerances and ideal beam-shaping results. Therefore, a measurement setup to precisely determine the up-to-date level of shrinkage has been setup. The goal is to provide necessary information on current shrinkage to the operator or assembly cell to adjust the compensation offset on a daily basis. Impacts of this information are expected to be an improved beam shaping result and a first-time-right production.