Hardening Cu-Ag composite by doping with Sc

被引：24

作者：

An, Bailing ^{[1
,2
]}

Xin, Yan ^{[4
]}

Niu, Rongmei ^{[4
]}

Lu, Jun ^{[4
]}

Wang, Engang ^{[1
,3
]}

Han, Ke ^{[4
]}

机构：

[1] Northeastern Univ, Minist Educ, Key Lab Electromagnet Proc Mat, Shenyang 110819, Liaoning, Peoples R China

[2] Northeastern Univ, Sch Mat Sci & Engn, Shenyang 110819, Liaoning, Peoples R China

[3] Northeastern Univ, Sch Met, Shenyang 110819, Liaoning, Peoples R China

[4] Florida State Univ, Natl High Magnet Field Lab, Tallahassee, FL 32310 USA

来源：

MATERIALS LETTERS | 2019年 / 252卷

基金：

国家重点研发计划; 美国国家科学基金会;

关键词：

Metallic composite; Cu-Ag composite; Sc doping; Hardness; Electrical properties; Precipitation; ZR ADDITIONS; MICROSTRUCTURE; CONDUCTIVITY; STRENGTH;

D O I：

10.1016/j.matlet.2019.05.101

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The microstructure and properties of Cu-Ag can be tuned by doping with Sc. To strengthen Cu-Ag while keeping cost low and electrical conductivity high, we lowered Ag content and added Sc. After aging treatment, our doped Cu-3 wt%Ag-0.3 wt% Sc contained exclusively continuous Ag precipitates, as opposed to exclusively discontinuous Ag precipitates in non-doped Cu-3 wt%Ag. After deformation at a low level of strain, electrical conductivity was almost the same in doped and non-doped samples, but Sc doping significantly improved hardness by suppressing formation of discontinuous Ag precipitates. (C) 2019 Elsevier B.V. All rights reserved.

引用

页码：207 / 210

页数：4

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